Cu表面生长Ag薄膜过程的分子动力学模拟
Molecular Dynamics Simulation of the Process of Growth of Ag Film on Cu Surface
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摘要: 采用分子动力学模拟方法,研究了在Cu衬底(001)平面气相A g粒子吸附和薄膜生长的动力学过程.模拟发现:气相A g原子在Cu衬底的吸附过程中(即镀膜过程),有很强的作为层状分布的趋势,在A g原子接触衬底后的弛豫过程中,A g原子按势作用力和热运动双重机制,有一定趋向地随机游走.A g原子的径向分布函数表明,A g镀膜层从下到上晶态特征逐渐减弱.Abstract: Molecular dynamic computer simulation has been carried out to study the process of film growth via Ag atoms absorbed on Cu (001) surface. The simulation showed that the distribution of Ag atoms in the film took on a distinct samdwich structure. In the process of relaxation after touching the substrate, the Ag atoms moved randomly but had a certain tendency under the simultaneous action of potential and thermal motion. It was observed and proved by radial distribution function that the crystalline character Ag atoms became weaker from bottom to top.
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